SERVICES — II.C
SIMULATION
BIG HARDWARE.
BIG STUDIES.
Hand us the brief.
Get a study.
When the geometry is too large for the cloud quota, the bench is too custom for the presets, or the deadline is too short for in-house iteration — fill the brief and we run the study end to end.
±1–5 %
vs IEEE benchmarks
100³
volumetric resolution
3 weeks
typical turnaround
NDA
signed before any handover
01Send the briefOne business day reply
TIMELINE
WHAT HAPPENS
BETWEEN BRIEF
AND DELIVERY
- 01BriefDay 0Form arrives. We reply within one business day to scope hours and price.
- 02SweepWeek 1Parameter sweep across candidate topologies; weekly written check-in.
- 03GAWeek 2Genetic optimiser converges. NSGA-II Pareto front when objectives compete.
- 04ValidateWeek 3Benchmark against the closest IEEE reference, inside ±5 %.
- 05DeliverWeek 3-4Typeset PDF, KiCad footprint, DXF, SPICE netlist, raw .airinduct session.
03What you get backFour artifacts, one study
PDF
Typeset report
Methods, assumptions, sweep, optimiser convergence, validation envelope.
CAD
KiCad + DXF
PCB footprint (.kicad_mod) and 2D outline ready for downstream CAD.
SPICE
Netlist
L · M · k component values for circuit-level simulation.
RAW
.airinduct session
Your team can keep iterating in the app after handover.
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